1. Good thermal and electrical conductivity under high temperatures
2. Good mechanical properties a under high temperatures
3. The material has better strength than pure copper, but lower conductivity than pure copper
4. Suitable for thick layer printing process
    | Particle size | 15-53μm | 
| Mobility | ≤ 20s | 
| Loose Density | ≥4.9g/cm³ | 
| Oxygen Content | ≤300ppm | 
